What do you think?
Rate this book
Fabrication Engineering at the Micro and Nanoscale
Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication. Completely
revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes.
The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite--the Silvaco Athena® set of codes--to provide meaningful examples of many of the basic processes including
diffusion, oxidation, lithography, and deposition.
The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for
improved performance.
revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes.
The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite--the Silvaco Athena® set of codes--to provide meaningful examples of many of the basic processes including
diffusion, oxidation, lithography, and deposition.
The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for
improved performance.
- GenresTextbooks
672 pages, Paperback
First published September 17, 2007
2 people are currently reading
34 people want to read
Ratings & Reviews
Friends & Following
Create a free account to discover what your friends think of this book!
