This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Despite being so compact (~100pages) this book goes deep into etching physics/chemistry while being easy to read and understand. Also it gives step-by-step examples of real device manufacturing, as well as new techniques and challenges of 32, 45 and 65nm nodes. Among the books about plasma etch and MEMS/semiconductor manufacturing I consider this one to be one of the best. (I'm a process development engineer in MEMS for ~10 years) Highly recommended.
Very compact book, mostly focus on Si fabrication techniques. I was looking for more…but cannot find the knowledge I would like to know on III-V semiconductors.