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Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
by
4.67 avg rating — 3 ratings
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published
2002
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3 editions
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Materials for Advanced Packaging
by
it was amazing 5.00 avg rating — 1 rating
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published
2008
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9 editions
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Electronic Packaging: Design, Materials, Process, and Reliability
by
liked it 3.00 avg rating — 1 rating
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published
1998
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International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces : Proceedings : Chateau Elan, Braselton, Georgia, March 14-17, 1999
by
0.00 avg rating — 0 ratings
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International Symposium on Advanced Pacakaging Materials: Processes, Properties and Interfaces : Chateau Elan, Braselton, Georgia March 6-8, 2000 : Proceedings
by
0.00 avg rating — 0 ratings
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published
1999
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Polymers for Electronic & Photonic Application
by
0.00 avg rating — 0 ratings
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published
1992
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4 editions
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Proceedings: 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces: Chateau Elan, Braselton, Georgia, March 15-18, 1998
by
0.00 avg rating — 0 ratings
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published
1998
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Nano-Bio- Electronic, Photonic and MEMS Packaging
by
0.00 avg rating — 0 ratings
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published
2009
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5 editions
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Advanced Flip Chip Packaging
by
0.00 avg rating — 0 ratings
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published
2011
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7 editions
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Electrical Conductive Adhesives with Nanotechnologies
by
0.00 avg rating — 0 ratings
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published
2009
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6 editions
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging
by
0.00 avg rating — 0 ratings
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published
2006
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4 editions
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Materials for Advanced Packaging
by
0.00 avg rating — 0 ratings
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published
2008
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2 editions
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Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863
by
0.00 avg rating — 0 ratings
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published
2005
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2 editions
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