Cher Ming Tan

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Cher Ming Tan

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Cher Ming Tan’s books

Average rating: 4.0 · 1 rating · 0 reviews · 9 distinct works

	Simulated Annealing really liked it 4.00 avg rating — 1 rating	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Electromigration In Ulsi Interconnections (International Series on Advances in Solid State Electronics and Technology) 0.00 avg rating — 0 ratings — published 2010 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections (Springer Series in Reliability Engineering) by Cher Ming Tan, Wei Li, Zhenghao Gan 0.00 avg rating — 0 ratings — published 2011 — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Electromigration Modeling at Circuit Layout Level by Cher Ming Tan, Feifei He 0.00 avg rating — 0 ratings — published 2013 — 6 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Theory and Practice of Quality and Reliability Engineering in Asia Industry by Cher Ming Tan (Editor), Thong Ngee Goh (Editor) 0.00 avg rating — 0 ratings — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Reliability and Failure Analysis of High-Power LED Packaging (Woodhead Publishing Series in Electronic and Optical Materials) by Cher Ming Tan, Preetpal Singh 0.00 avg rating — 0 ratings — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Reliability Analysis of Electrotechnical Devices 0.00 avg rating — 0 ratings	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronic Yield, Reliability, and Advanced Packaging 0.00 avg rating — 0 ratings	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections (Springer Series in Reliability Engineering) by Cher Ming Tan, Wei Li, Zhenghao Gan 0.00 avg rating — 0 ratings	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars

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