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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages > Editions

by Gerard Kelly First published April 30th 1999

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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (Kindle Edition)
Published December 6th 2012 by Springer
1999, Kindle Edition, 226 pages
Author(s):
ISBN:
9781461550112 (ISBN10: 1461550114)
ASIN:
B00FBD6BLI
Edition language:
English
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (Kindle Edition)
Published December 6th 2012 by Springer
Kindle Edition
Author(s):
ASIN:
B0D39M3HVP
Edition language:
English
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (Paperback)
Published October 8th 2011 by Springer
Paperback, 160 pages
Author(s):
ISBN:
9781461550129 (ISBN10: 1461550122)
ASIN:
1461550122
Edition language:
English
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (Paperback)
Published October 8th 2012 by Springer
1999, Paperback, 153 pages
Author(s):
ISBN:
9781461372769 (ISBN10: 1461372763)
ASIN:
1461372763
Edition language:
English
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