Microelectronics Packaging Handbook, Part I > Editions
by Rao R. Tummala First published January 15th 1997
Published
by springer; 2nd edition (january 31, 1997)
Unknown Binding, 0 pages
Published May 14th 2012
by Springer
Paperback, 752 pages
Published October 23rd 2012
by Springer
Softcover reprint of the original 2nd ed. 1997, Second Edition 1997, Paperback, 747 pages
Published January 31st 1997
by Springer
2nd, Hardcover, 747 pages




