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Microelectronics Packaging Handbook Part II > Editions

by Rao R. Tummala First published January 31st 1997

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Microelectronics Packaging Handbook Part II: Semiconductor Packaging
Microelectronics Packaging Handbook Part II: Semiconductor Packaging (Hardcover)
Published January 31st 1997 by Springer
2nd, Hardcover, 1,030 pages
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ISBN:
9780412084416 (ISBN10: 0412084414)
ASIN:
0412084414
Edition language:
English
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Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1) by Tummala, Rao, Rymaszewski, Eugene J., Klopfenstein, Alan G. (1997) Hardcover
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1) by Tummala, Rao, Rymaszewski, Eugene J., Klopfenstein, Alan G. (1997) Hardcover
Published January 1st 1997 by Springer
2nd Edition, Hardcover, 0 pages
Author(s):
ASIN:
B00YDJYM3K
Edition language:
English
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