Fundamentals of Microsystems Packaging > Editions
by Rao R. Tummala First published January 1st 2000
Published May 29th 2001
by McGraw-Hill Education
1, Hardcover, 967 pages
Published September 2nd 2019
by McGraw Hill
2, Hardcover, 848 pages
![[(Fundamentals of Microsystems Packaging)] [By (author) R. R. Tummala] published on (June, 2001)](https://i.gr-assets.com/images/S/compressed.photo.goodreads.com/books/1699211612l/130170904._SX50_.jpg)
Published
by McGraw-Hill Education
Hardcover, 0 pages
Published May 29th 2001
by McGraw Hill
1, Kindle Edition, 967 pages
Published January 1st 2001
by McGraw-Hill Professional
I.S.ed, Paperback, 0 pages
