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MEMS Packaging > Editions

by Tai-Ran Hsu First published December 2003

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MEMS Packaging (Materials, Circuits and Devices)
MEMS Packaging (Materials, Circuits and Devices)
Published December 5th 2003 by The Institution of Engineering and Technology
Hardcover, 304 pages
Author(s):
ISBN:
9780863413353 (ISBN10: 0863413358)
ASIN:
0863413358
Edition language:
English
Average rating:
4.33 (3 ratings)
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Mems Packaging (EMIS Processing) (Materials, Circuits and Devices)
Mems Packaging (EMIS Processing) (Materials, Circuits and Devices)
Published November 1st 2003 by Institution of Engineering and Technology
Kindle Edition, 304 pages
Author(s):
ISBN:
9781849190626 (ISBN10: 1849190623)
ASIN:
B004BSFFTS
Edition language:
English
Average rating:
0.0 (0 ratings)
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