RF and Microwave Microelectronics Packaging II > Editions

by Ken Kuang

RF and Microwave Microelectronics Packaging II
Published March 22nd 2017 by Springer
1st ed. 2017, Hardcover, 184 pages
Author(s):
ISBN:
9783319516967 (ISBN10: 3319516965)
ASIN:
3319516965
Edition language:
English
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RF and Microwave Microelectronics Packaging II
Published March 15th 2017 by Springer
Paperback, 186 pages
Author(s):
ISBN:
9783319516981 (ISBN10: 3319516981)
ASIN:
3319516981
Edition language:
English
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RF and Microwave Microelectronics Packaging II
Published June 9th 2018 by Springer
Softcover reprint of the original 1st ed. 2017, Paperback, 184 pages
Author(s):
ISBN:
9783319847191 (ISBN10: 3319847198)
ASIN:
3319847198
Edition language:
English
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