RF and Microwave Microelectronics Packaging II > Editions
by Ken Kuang
Published March 22nd 2017
by Springer
1st ed. 2017, Hardcover, 184 pages
Published March 15th 2017
by Springer
Paperback, 186 pages
Published June 9th 2018
by Springer
Softcover reprint of the original 1st ed. 2017, Paperback, 184 pages



