Microelectronics Packaging Handbook > Editions

by Rao R. Tummala First published January 31st 1997

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Microelectronics Packaging Handbook: Subsystem Packaging Part III (Hardcover)

Published January 31st 1997 by Springer

2nd, Hardcover, 628 pages

Author(s):

Rao R. Tummala,

Eugene J. Rymaszewski,

Alan G. Klopfenstein

ISBN:

9780412084515 (ISBN10: 0412084511)

ASIN:

0412084511

Edition language:

English

Average rating:

3.00 (1 rating)

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