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Are you John H. Lau, author of the books below?
Semiconductor Advanced Packaging by John H. Lau Chip Scale Package by John H. Lau Electronics Manufacturing by John H. Lau Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pit... by John H. Lau Solder Joint Reliability by John H. Lau Chip On Board by John H. Lau Flip Chip Technologies by John H. Lau Microvias by John H. Lau Electronic Packaging by John H. Lau Fan-Out Wafer-Level Packaging by John H. Lau


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