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John H. Lau

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John H. Lau

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John H. Lau’s books

Average rating: 3.95 · 19 ratings · 2 reviews · 27 distinct works

	Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by John H. Lau, C.P. Wong, Ning-Cheng Lee 4.67 avg rating — 3 ratings — published 2002 — 3 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Semiconductor Advanced Packaging 3.50 avg rating — 4 ratings — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Chip Scale Package: Design, Materials, Process, Reliability, and Applications by John H. Lau, Ricky S.W. Lee, S.W. Ricky Lee 3.33 avg rating — 3 ratings — published 1999 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by John H. Lau, Yi-Hsin Pao it was amazing 5.00 avg rating — 1 rating — published 1996 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Solder Joint Reliability: Theory and Applications it was amazing 5.00 avg rating — 1 rating — published 1991 — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Chip On Board: Technology for Multichip Modules really liked it 4.00 avg rating — 1 rating — published 1994 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Flip Chip Technologies really liked it 4.00 avg rating — 1 rating	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microvias: For Low Cost, High Density Interconnects by John H. Lau, S.W. Ricky Lee liked it 3.00 avg rating — 1 rating — published 2000 — 5 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Electronic Packaging: Design, Materials, Process, and Reliability by John H. Lau, C.P. Wong liked it 3.00 avg rating — 1 rating — published 1998	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Handbook of Fine Pitch Surface Mount Technology 0.00 avg rating — 0 ratings — published 1993 — 3 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars

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