Books by John H. Lau

John H. Lau
Average rating 3.95 · 19 ratings · 2 reviews · shelved 83 times

Showing 27 distinct works.

	Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by John H. Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee 4.67 avg rating — 3 ratings — published 2002 — 3 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Semiconductor Advanced Packaging by John H. Lau 3.50 avg rating — 4 ratings — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Chip Scale Package: Design, Materials, Process, Reliability, and Applications by John H. Lau, Ricky S.W. Lee, S.W. Ricky Lee 3.33 avg rating — 3 ratings — published 1999 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Mechanics of Solder Alloy Interconnects by Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau really liked it 4.00 avg rating — 2 ratings — published 1993 — 3 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by John H. Lau, Yi-Hsin Pao it was amazing 5.00 avg rating — 1 rating — published 1996 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Solder Joint Reliability: Theory and Applications by John H. Lau it was amazing 5.00 avg rating — 1 rating — published 1991 — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Thermal Stress and Strain in Microelectronics Packaging by John H. Lau (Editor) it was amazing 5.00 avg rating — 1 rating — published 1993 — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Chip On Board: Technology for Multichip Modules by John H. Lau really liked it 4.00 avg rating — 1 rating — published 1994 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Flip Chip Technologies by John H. Lau really liked it 4.00 avg rating — 1 rating	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microvias: For Low Cost, High Density Interconnects by John H. Lau, S.W. Ricky Lee liked it 3.00 avg rating — 1 rating — published 2000 — 5 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Electronic Packaging: Design, Materials, Process, and Reliability by John H. Lau, C.P. Wong liked it 3.00 avg rating — 1 rating — published 1998	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	3D IC Integration and Packaging by John H. Lau 0.00 avg rating — 0 ratings — published 2015 — 6 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Fan-Out Wafer-Level Packaging by John H. Lau 0.00 avg rating — 0 ratings	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Heterogenous Integration by John H. Lau 0.00 avg rating — 0 ratings — 6 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Assembly and Reliability of Lead-Free Solder Joints by John H. Lau, Ning-Cheng Lee 0.00 avg rating — 0 ratings — 5 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Chiplet Design and Heterogeneous Integration Packaging by John H. Lau 0.00 avg rating — 0 ratings — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Chip Scale Package: Design, Materials, Process, Reliability, and Applications by Lau, John H., Lee, Ricky S.W., Lee, S.W. Ricky(February 28, 1999) Hardcover by John H. Lau 0.00 avg rating — 0 ratings — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	By John H. Lau - Chip On Board: 1st (first) Edition by John H. Lau 0.00 avg rating — 0 ratings	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by John H. Lau 0.00 avg rating — 0 ratings — 3 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Thirteenth IEEE/Chmt International Electronics Manufacturing Technology Symposium: Integrated Manufacturing, the Future is Now: September 28-30, 1992, Baltimore, MD, USA by John H. Lau (Contributor) 0.00 avg rating — 0 ratings — published 1992 — 3 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies by John H. Lau 0.00 avg rating — 0 ratings — published 2000	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Through-Silicon Vias for 3D Integration by John H. Lau 0.00 avg rating — 0 ratings — published 2012 — 5 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Reliability of RoHS-Compliant 2D and 3D IC Interconnects by John H. Lau 0.00 avg rating — 0 ratings — published 2010 — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Advanced MEMS Packaging by John H. Lau, C.S. Premachandran, Yu Aibin, Cheng Kuo Lee 0.00 avg rating — 0 ratings — published 2009 — 3 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Ball Grid Array Technology by John H. Lau 0.00 avg rating — 0 ratings — published 1994	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Handbook Of Tape Automated Bonding by John H. Lau 0.00 avg rating — 0 ratings — published 1992 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Handbook of Fine Pitch Surface Mount Technology by John H. Lau 0.00 avg rating — 0 ratings — published 1993 — 3 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars

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