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3D IC Integration and Packaging > Editions

by John H. Lau First published July 6th 2015

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3D IC Integration and Packaging
3D IC Integration and Packaging (Kindle Edition)
Published July 6th 2015 by McGraw Hill
1, Kindle Edition, 734 pages
Author(s):
ISBN:
9780071848077 (ISBN10: 007184807X)
ASIN:
B013VXFNKY
Edition language:
English
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3D IC Integration and Packaging
3D IC Integration and Packaging (Hardcover)
Published August 27th 2015 by McGraw Hill
1, Hardcover, 480 pages
Author(s):
ISBN:
9780071848060 (ISBN10: 0071848061)
ASIN:
0071848061
Edition language:
English
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3D IC Integration and Packaging by John Lau (August 27,2015)
3D IC Integration and Packaging by John Lau (August 27,2015)
Published January 1st 1700 by McGraw-Hill Education (August 27,2015)
Hardcover, 0 pages
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ASIN:
B01B98YZDO
Edition language:
English
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3D IC Integration and Packaging by John Lau (2015-08-27)
3D IC Integration and Packaging by John Lau (2015-08-27)
Published by McGraw-Hill Education
Hardcover, 0 pages
Author(s):
ASIN:
B01JXUAWE6
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