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Chip Scale Package > Editions

by John H. Lau First published February 28th 1999

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Chip Scale Package: Design, Materials, Process, Reliability, and Applications
Chip Scale Package: Design, Materials, Process, Reliability, and Applications (Hardcover)
Published February 28th 1999 by McGraw-Hill Professional
1, Hardcover
Author(s):
ISBN:
9780070383043 (ISBN10: 0070383049)
ASIN:
0070383049
Edition language:
English
Average rating:
3.33 (3 ratings)
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Chip Scale Package, CSP
Chip Scale Package, CSP (ebook)
Published February 28th 1999 by McGraw-Hill Professional Publishing
ebook, 564 pages
Author(s):
ISBN:
9780071609630 (ISBN10: 0071609636)
ASIN:
0071609636
Average rating:
0.0 (0 ratings)
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