Chip Scale Package > Editions

by John H. Lau

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Chip Scale Package: Design, Materials, Process, Reliability, and Applications by Lau, John H., Lee, Ricky S.W., Lee, S.W. Ricky(February 28, 1999) Hardcover

Published by McGraw-Hill Professional

Unknown Binding, 0 pages

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ASIN:

B014S2V8L0

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