Electronics Packaging Forum > Editions

by James E. Morris First published December 1st 1993

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Electronics Packaging Forum: Multichip Module Technology Issues (1994-03-03)
Electronics Packaging Forum: Multichip Module Technology Issues (1994-03-03)
Published by Ieee
Hardcover, 0 pages
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ASIN:
B01FEPJ6NW
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Electronics Packaging Forum - Multichip Module Technology Issues
Electronics Packaging Forum - Multichip Module Technology Issues (Paperback)
Published January 1st 1994 by Institute Of Electrical & Electronics Engineers
Paperback, 0 pages
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ASIN:
B0074CXLDA
Edition language:
English
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Electronics Packaging Forum: Multichip Module Technology Issues
Electronics Packaging Forum: Multichip Module Technology Issues (Hardcover)
Published January 1st 1994 by IEEE
Hardcover, 392 pages
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ISBN:
9780780304390 (ISBN10: 078030439X)
ASIN:
078030439X
Edition language:
English
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