Books by Rao R. Tummala

Rao R. Tummala
Average rating 4.00 · 5 ratings · 1 reviews · shelved 34 times

Showing 17 distinct works.

	Fundamentals of Microsystems Packaging by Rao R. Tummala it was amazing 5.00 avg rating — 2 ratings — published 2000 — 5 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronics Packaging Handbook by Rao R. Tummala really liked it 4.00 avg rating — 1 rating — published 1998 — 3 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronics Packaging Handbook Part II: Semiconductor Packaging by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein liked it 3.00 avg rating — 1 rating — published 1997 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronics Packaging Handbook: Subsystem Packaging Part III by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein liked it 3.00 avg rating — 1 rating — published 1997 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Second Level Microelect Packaging by Rao R. Tummala 0.00 avg rating — 0 ratings — published 1998	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57) by Rao R. Tummala (Editor) 0.00 avg rating — 0 ratings — published 2000 — 4 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronics Packaging Handbook, Part I: Technology Drivers by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein 0.00 avg rating — 0 ratings — published 1997 — 5 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectron pkg fu by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein 0.00 avg rating — 0 ratings — published 2001	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronics Packaging Handbook: Technologies by Rao R. Tummala, Alan G. Klopfenstein 0.00 avg rating — 0 ratings — published 1996	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein 0.00 avg rating — 0 ratings — published 1997 — 2 editions	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronics Package Wiring and Electrical Design by Rao R. Tummala 0.00 avg rating — 0 ratings — published 1998	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Plastic, Thin-Film, and Ceramic Packaging by Rao R. Tummala 0.00 avg rating — 0 ratings — published 1998	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronics Packaging Handbook: Applications by Rao R. Tummala 0.00 avg rating — 0 ratings — published 1996	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Heat Transfer in Electronic Packages by Rao R. Tummala 0.00 avg rating — 0 ratings — published 1998	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Wirebonding in Microelectronics Packaging by Rao R. Tummala 0.00 avg rating — 0 ratings — published 1998	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Fundamentals of Device and Systems Packaging: Technologies and Applications by Rao R. Tummala 0.00 avg rating — 0 ratings	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars
	Microelectronics Packaging Handbook : Technology Drivers Part I (Paperback)--by Rao R. Tummala [2012 Edition] by Alan G. Klopfenstein, Eugene J. Rymaszewski, Rao R. Tummala, Unknown Author 0.00 avg rating — 0 ratings	Error rating book. Refresh and try again. Rate this book Clear rating 1 of 5 stars 2 of 5 stars 3 of 5 stars 4 of 5 stars 5 of 5 stars

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